0447641801
Molex
Product No:
0447641801
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
CONN RCPT 18P 0.118 TIN PCB R/A
Quantity:
In Stock : Please Inquiry
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Product Information
Parameter Info
| Mfr | Molex |
| Style | Board to Board or Cable |
| Series | Micro-Fit 3.0 BMI 44764 |
| Package | Tray |
| Features | Blind Mating, Board Guide |
| Termination | Solder |
| Applications | General Purpose, Telecommunications |
| Contact Type | Female Socket |
| Contact Shape | Square |
| Mounting Type | Through Hole, Right Angle |
| Connector Type | Receptacle |
| Fastening Type | Push-Pull |
| Number of Rows | 2 |
| Pitch - Mating | 0.118" (3.00mm) |
| Product Status | Active |
| Voltage Rating | 600VAC |
| Contact Material | Phosphor Bronze |
| Insulation Color | Black |
| Insulation Height | 0.402" (10.20mm) |
| Ingress Protection | - |
| Base Product Number | 044764 |
| Insulation Material | Liquid Crystal Polymer (LCP), Glass Filled |
| Number of Positions | 18 |
| Row Spacing - Mating | 0.118" (3.00mm) |
| Contact Finish - Post | Tin |
| Contact Length - Post | 0.155" (3.94mm) |
| Current Rating (Amps) | 5A |
| Operating Temperature | -40°C ~ 105°C |
| Mated Stacking Heights | - |
| Contact Finish - Mating | Tin |
| Number of Positions Loaded | All |
| Material Flammability Rating | UL94 V-0 |
| Contact Finish Thickness - Post | 40.0µin (1.02µm) |
| Contact Finish Thickness - Mating | 40.0µin (1.02µm) |
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