HSB23-232325
CUI Devices
Product No:
HSB23-232325
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
HEAT SINK, BGA, 23 X 23 X 25 MM
Quantity:
In Stock : Please Inquiry
Please send RFQ , we will respond immediately.
Product Information
Parameter Info
| Mfr | CUI Devices |
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 0.906" (23.00mm) |
| Length | 0.906" (23.00mm) |
| Series | HSB |
| Package | Box |
| Diameter | - |
| Material | Aluminum Alloy |
| Fin Height | 0.984" (25.00mm) |
| Package Cooled | BGA |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive |
| Thermal Resistance @ Natural | 12.23°C/W |
| Power Dissipation @ Temperature Rise | 6.13W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 3.80°C/W @ 200 LFM |
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
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