HSB28-606022
CUI Devices
Product No:
HSB28-606022
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
HEAT SINK, BGA, 60 X 60 X 22 MM,
Quantity:
In Stock : Please Inquiry
Please send RFQ , we will respond immediately.
Product Information
Parameter Info
| Mfr | CUI Devices |
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 2.362" (60.00mm) |
| Length | 2.362" (60.00mm) |
| Series | HSB |
| Package | Box |
| Diameter | - |
| Material | Aluminum Alloy |
| Fin Height | 0.866" (22.00mm) |
| Package Cooled | BGA |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Push Pin |
| Thermal Resistance @ Natural | 4.74°C/W |
| Power Dissipation @ Temperature Rise | 15.83W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 1.40°C/W @ 200 LFM |
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
Information
Follow Us
Quick Links
