HSS-C2540-SMT-TR
CUI Devices
Product No:
HSS-C2540-SMT-TR
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
HEAT SINK TO-263 COPPER
Quantity:
In Stock : Please Inquiry
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Product Information
Parameter Info
| Mfr | CUI Devices |
| Type | Board Level |
| Shape | Rectangular, Fins |
| Width | 1.000" (25.40mm) |
| Length | 0.763" (19.38mm) |
| Series | HSS |
| Package | Tape & Reel (TR) |
| Diameter | - |
| Material | Copper |
| Fin Height | 0.450" (11.43mm) |
| Package Cooled | TO-263 (D²Pak) |
| Product Status | Active |
| Material Finish | Tin |
| Attachment Method | - |
| Base Product Number | HSS-C2540 |
| Thermal Resistance @ Natural | 21.90°C/W |
| Power Dissipation @ Temperature Rise | 3.8W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 5.50°C/W @ 200 LFM |
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
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