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HSS05-C20-SMT-TR

CUI Devices

Product No:

HSS05-C20-SMT-TR

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

Description:

HEAT SINK, STAMPING, TO-220, 12.

Quantity:

In Stock : Please Inquiry

Please send RFQ , we will respond immediately.

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Product Information

Parameter Info
Mfr CUI Devices
Type Board Level, Vertical
Shape Rectangular
Width 0.500" (12.70mm)
Length 1.031" (26.20mm)
Series HSS
Package Tape & Reel (TR)
Diameter -
Material Copper Alloy
Fin Height 0.390" (9.91mm)
Package Cooled TO-220
Product Status Active
Material Finish Tin
Attachment Method -
Thermal Resistance @ Natural 32.69°C/W
Power Dissipation @ Temperature Rise 2.3W @ 75°C
Thermal Resistance @ Forced Air Flow 14.00°C/W @ 200 LFM