CUI Devices
Product No:
HSS07-C20-P274
Manufacturer:
Package:
-
Batch:
-
Description:
HEAT SINK, STAMPING, TO-220, 21.
Quantity:
Please send RFQ , we will respond immediately.
Mfr | CUI Devices |
Type | Board Level, Vertical |
Shape | Rectangular |
Width | 0.520" (13.21mm) |
Length | 0.853" (21.66mm) |
Series | HSS |
Package | Box |
Diameter | - |
Material | Copper Alloy |
Fin Height | 0.515" (13.08mm) |
Package Cooled | TO-220 |
Product Status | Active |
Material Finish | Tin |
Attachment Method | PC Pin |
Thermal Resistance @ Natural | 29.57°C/W |
Power Dissipation @ Temperature Rise | 2.5W @ 75°C |
Thermal Resistance @ Forced Air Flow | 12.60°C/W @ 200 LFM |