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HSS07-C20-P274

CUI Devices

Product No:

HSS07-C20-P274

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

Description:

HEAT SINK, STAMPING, TO-220, 21.

Quantity:

In Stock : Please Inquiry

Please send RFQ , we will respond immediately.

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Product Information

Parameter Info
Mfr CUI Devices
Type Board Level, Vertical
Shape Rectangular
Width 0.520" (13.21mm)
Length 0.853" (21.66mm)
Series HSS
Package Box
Diameter -
Material Copper Alloy
Fin Height 0.515" (13.08mm)
Package Cooled TO-220
Product Status Active
Material Finish Tin
Attachment Method PC Pin
Thermal Resistance @ Natural 29.57°C/W
Power Dissipation @ Temperature Rise 2.5W @ 75°C
Thermal Resistance @ Forced Air Flow 12.60°C/W @ 200 LFM